The formation of Cu-Cu joints by low temperature sintering Cu NPs with copper formate layer and its oxidation enhancement
Dongfang Dai, Jincheng Li, Jing Qian, Zeping Wang, Kai Zheng, Jiabing Yu, Xianping Chen
Topics & Concepts
Materials scienceSinteringCopperElectrical resistivity and conductivityFormateShear strength (soil)Formic acidMetallurgyNanoparticleLayer (electronics)Electrical conductorComposite materialChemical engineeringNanotechnologyChemistryCatalysisChromatographyElectrical engineeringBiochemistrySoil scienceEngineeringSoil waterEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesNanomaterials and Printing Technologies