Thermal Properties Study of Low‐Melting‐Point‐DNAN and Analysis of Solidification Behavior of High‐Melting‐Point‐DNAN
Danan Shi, Lizhen Chen, Jianlong Wang, Jun Chen, Pan Hongxia
Abstract
Abstract 2,4‐dinitroanisole (DNAN) is considered to be the most promising alternative to 1,3,5‐trinitrotoluene (TNT), and the high‐melting‐point‐DNAN (H‐DNAN) has been widely used in military explosives. In this study, the thermal properties of low‐melting‐point‐DNAN (L‐DNAN) was studied by DSC. It was found the melting enthalpy of L‐DNAN is 17.87 kJ mol −1 and the decomposition activation energies were obtained by Kissinger and Flynn‐Wall‐Ozawa methods as 200 kJ mol −1 and 198 kJ mol −1 , respectively. Besides, it was also found that the cooling rate is the main factor that affects the solidification behavior of H‐DNAN. Controlled and slow cooling allows L‐DNAN crystallization from the melt of the more thermodynamically stable high melting point polymorph.