Simulation of slurry residence time during chemical-mechanical polishing using 3-D computational fluid dynamics
Kuang C. Lin, Chuan-Chieh Liao
Topics & Concepts
WaferSlurryComputational fluid dynamicsChemical-mechanical planarizationMaterials sciencePolishingResidence time distributionFluid dynamicsFabricationFlow (mathematics)Composite materialMechanical engineeringMechanicsNanotechnologyEngineeringPhysicsPathologyAlternative medicineMedicineAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Machining and Optimization Techniques