Fracture strength of photovoltaic silicon wafers cut by diamond wire saw based on half-penny crack system
Liyuan Wang, Yufei Gao, Tianzhao Pu, Youkang Yin
Topics & Concepts
WaferMaterials scienceDiamondAbrasiveWafer dicingComposite materialFracture (geology)SiliconFlexural strengthFracture mechanicsStress (linguistics)MetallurgyOptoelectronicsPhilosophyLinguisticsAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchTunneling and Rock Mechanics