Litcius/Paper detail

Thermal conductivity of epoxy composites containing 3D honeycomb boron nitride filler

Guang Liu, Ao Ding, Pingfan Xu, Min Zhu, Haizhong Zhang, Yuying Zheng, Yaofa Luo, Zhang Li, Peikun Zhang, Ai‐Zheng Chen, Yuan Liu, Chao He, Chao He

2024Chemical Engineering Journal33 citationsDOI

Topics & Concepts

Materials scienceComposite materialEpoxyThermal conductivityBoron nitrideMicroelectronicsComposite numberThermal resistanceHoneycomb structureThermal insulationHoneycombHeat transferNanotechnologyThermodynamicsLayer (electronics)PhysicsThermal properties of materialsDielectric materials and actuatorsHeat Transfer and Optimization