Void and solder joint detection for chip resistors based on X-ray images and deep neural networks
Shuiling Pang, Meiyun Chen, Shiwo Ta, Heng Wu, Kiyoshi Takamasu
Topics & Concepts
ResistorChipSolderingResidualMaterials scienceComputer scienceVoid (composites)StencilArtificial intelligenceElectronic engineeringAlgorithmElectrical engineeringEngineeringComposite materialComputational scienceTelecommunicationsVoltageIntegrated Circuits and Semiconductor Failure AnalysisIndustrial Vision Systems and Defect DetectionElectronic Packaging and Soldering Technologies