Litcius/Paper detail

Development of anti-oxidation Ag salt paste for large-area (35 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" altimg="si1.svg"><mml:mo>×</mml:mo></mml:math> 35 mm2) Cu-Cu bonding with ultra-high bonding strength

Bowen Zhang, Chuantong Chen, Takuya Sekiguchi, Yang Liu, Cai‐Fu Li, Katsuaki Suganuma

2022Journal of Material Science and Technology33 citationsDOI

Topics & Concepts

SinteringMaterials sciencePorosityFormic acidMicrostructureOxideSalt (chemistry)Composite materialMetallurgyOrganic chemistryChemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties
Development of anti-oxidation Ag salt paste for large-area (35 <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" altimg="si1.svg"><mml:mo>×</mml:mo></mml:math> 35 mm2) Cu-Cu bonding with ultra-high bonding strength | Litcius