A novel heat transfer characterization method for a thermal management scheme of 3D-IC chips
Yichi Zhang, Chenxi Ding, Rui Feng, Kaixi Bi, Wenping Geng, Xiujian Chou
Topics & Concepts
Materials scienceHeat transferSiliconMicrofabricationTransient (computer programming)Deep reactive-ion etchingEtching (microfabrication)ThermalThree-dimensional integrated circuitRaman spectroscopyOptoelectronicsMechanical engineeringReactive-ion etchingIntegrated circuitComposite materialOpticsMechanicsComputer scienceEngineeringFabricationThermodynamicsPhysicsOperating systemPathologyMedicineAlternative medicineLayer (electronics)Thermal properties of materialsHeat Transfer and Optimization3D IC and TSV technologies