Bonding mechanism in Cu coating deposited on Al alloy substrate: Combining molecular dynamics simulation and experiment
Ling Shao, Weiwei Li, Qingsong Lu, Na Xue, Yingwei Chen, Yincheng Wu, Chengqing Liu, Yizhe Liu, Khurram Sajjad, Qi Shi, Chenxiao Wang, J.W. Lv, Minghui Ye, Tao Zhou, Jiankang Huang, Liu Zhu
Topics & Concepts
Molecular dynamicsMaterials scienceMechanism (biology)AlloySubstrate (aquarium)CoatingDynamics (music)CopperMetallurgyNanotechnologyChemical physicsChemical engineeringChemistryComputational chemistryPhysicsEngineeringGeologyAcousticsOceanographyQuantum mechanicsHigh-Temperature Coating BehaviorsMetal and Thin Film MechanicsCopper Interconnects and Reliability