On-chip hotspot thermal delay and peak clipping using a heterogeneously integrated micro-thermoelectric cooler
Tingrui Gong, Chensheng Ma, Linwei Cao, Wei Su
Topics & Concepts
Materials scienceThermoelectric effectHotspot (geology)ThermalClipping (morphology)ChipOptoelectronicsThermoelectric coolingElectronic engineeringComposite materialElectrical engineeringEngineeringMeteorologyThermodynamicsPhysicsGeophysicsLinguisticsPhilosophy3D IC and TSV technologiesAdvanced Thermoelectric Materials and DevicesAdvancements in Semiconductor Devices and Circuit Design