Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam
He Huang, Shangyu Huang, Yongchao Ye, Yong Xiao, Zhihao Zhang, Mingyu Li, Russell Goodall
Topics & Concepts
SolderingMaterials scienceUltimate tensile strengthShear strength (soil)AlloyDissolutionComposite materialMicrostructureMetallurgyComposite numberPhase (matter)Chemical engineeringSoil waterEnvironmental scienceEngineeringChemistryOrganic chemistrySoil scienceElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisAluminum Alloys Composites Properties