Low-temperature Cu-Cu direct bonding with ultra-large grains using highly (110)-oriented nanotwinned copper
Huahan Li, Zhaolan Liang, Zeyu Ning, Ziyu Liu, Ming Li, Yunwen Wu
Topics & Concepts
Materials scienceCopperMetallurgy3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites Properties