High reliability of piezoresistive pressure sensors by wafer to wafer direct bonding at room temperature
Bin Song, Fanliang Li, Fulong Zhu, Sheng Liu
Topics & Concepts
Piezoresistive effectFabricationPressure sensorWaferMaterials scienceMicroelectronicsAnnealing (glass)OptoelectronicsElectronic engineeringNanotechnologyComposite materialMechanical engineeringEngineeringAlternative medicinePathologyMedicineAdvanced MEMS and NEMS TechnologiesAdvanced Sensor and Energy Harvesting MaterialsElectrical and Thermal Properties of Materials