Effect of aging process on the microstructure and properties of Cu–Cr–Ti alloy
Shaoli Fu, Ping Liu, Xiaohong Chen, Honglei Zhou, Fengcang Ma, Wei Li, Ke Zhang
Topics & Concepts
MicrostructureMaterials scienceAlloyIndentation hardnessUltimate tensile strengthScanning electron microscopeTransmission electron microscopyElectrical resistivity and conductivityMetallurgyPrecipitationCopperConductivityComposite materialChemistryNanotechnologyPhysical chemistryMeteorologyEngineeringElectrical engineeringPhysicsMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis