Enhanced adhesion strength between electroplated Cu and ABF substrate with isothermal annealing treatment
Pei-Chia Hsu, Shun-Cheng Chang, Wen-Xuan Lu, Hung-Cheng Liu, Cheng–En Ho
Topics & Concepts
Materials scienceX-ray photoelectron spectroscopyElectroplatingMicrostructureAnnealing (glass)Electron backscatter diffractionIsothermal processScanning electron microscopeComposite materialAnalytical Chemistry (journal)MetallurgyChemical engineeringChemistryLayer (electronics)ChromatographyThermodynamicsEngineeringPhysicsMetal and Thin Film MechanicsCopper Interconnects and ReliabilityCorrosion Behavior and Inhibition