Preparation of biphenyl-containing polybenzoxazines with low dielectric constants and high thermal stability
Angui Lu, Hao Lin, Manlin Yuan, Liyan Shao, Xin Lu, Zhong Xin, Zhong Xin
Topics & Concepts
Thermal stabilityDielectricDifferential scanning calorimetryMaterials scienceCuring (chemistry)BiphenylMonomerFourier transform infrared spectroscopyDielectric lossPolymer chemistryChemical engineeringOrganic chemistryChemistryComposite materialPolymerThermodynamicsOptoelectronicsPhysicsEngineeringEpoxy Resin Curing ProcessesSynthesis and properties of polymersLiquid Crystal Research Advancements