Shear strength and fracture analysis of Sn-9Zn-2.5Bi-1.5In and Sn-3.0Ag-0.5Cu pastes with Cu-substrate joints under different reflow times
Shiliang Gong, Gaoqiang Chen, Songtao Qu, Anshi Ren, Vichea Duk, Qingyu Shi, Gong Zhang
Topics & Concepts
SolderingIntermetallicMaterials scienceShear strength (soil)Shear (geology)Composite materialFracture (geology)MetallurgySubstrate (aquarium)Direct shear testMicrostructureAlloyGeologyOceanographySoil waterSoil scienceElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques Analysis3D IC and TSV technologies