Influences of silicon carbide nanowires’ addition on IMC growth behavior of pure Sn solder during solid–liquid diffusion

Mulan Li, Liang Zhang, Nan Jiang, Sujuan Zhong, Lei Zhang, Lei Zhang, Lei Zhang

2021Journal of Materials Science Materials in Electronics11 citationsDOI

Topics & Concepts

Materials scienceSolderingIntermetallicWettingSilicon carbideMetallurgyBrittlenessComposite materialShear strength (soil)SiliconDiffusionEnvironmental scienceAlloyPhysicsThermodynamicsSoil waterSoil scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties