Enhanced in-plane thermal conductivity of polyimide-based composites<i>via in situ</i>interfacial modification of graphene

Abstract

. Finite element simulation and 1000 bending tests are carried out to further verify the performance advantages of the integrated structure in the internal thermal diffusion and long-term use of the composite. M@GNS/PI with integrated structure provides extra heat transfer channels for heat dissipation, possibly providing an effective way to address the traditional thermal accumulation issue of electronic devices.

Topics & Concepts