A comprehensive study on the effect of molecular chain flexibility on the low-temperature curing ability of polyimides
Shan Huang, Yao Zhang, Xingwang Lai, Xialei Lv, Jinhui Li, Siyao Qiu, Guoping Zhang, Rong Sun
Abstract
As stringent demands for PI materials with low-temperature curable properties have increased in the high-frequency communication era, the introduction of flexible structures has gained prominence for enhancing molecular chain mobility.
Topics & Concepts
Materials scienceCuring (chemistry)Flexibility (engineering)Chain (unit)Composite materialNanotechnologyStatisticsMathematicsPhysicsAstronomySynthesis and properties of polymersEpoxy Resin Curing ProcessesSilicone and Siloxane Chemistry