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High performance Cu sintering joint for power devices enabled by in-situ generation of Cu particles with multi-level hierarchical structures

Jianbo Xin, Yue Gao, Chenghao Zhang, Le Yang, Sushi Liu, Ke Li, Minghao Zhou, Yang Liu, Jing Zhang, William Cai, Jing Zhang, William Cai

2024Journal of Materials Processing Technology16 citationsDOI

Topics & Concepts

SinteringMaterials scienceComposite numberParticle (ecology)CopperComposite materialIn situMetallurgyOceanographyPhysicsGeologyMeteorologyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties
High performance Cu sintering joint for power devices enabled by in-situ generation of Cu particles with multi-level hierarchical structures | Litcius