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Numerical investigation on material removal mechanism in elliptical vibration cutting of single-crystal silicon

Changlin Liu, Jianguo Zhang, Junjie Zhang, Jianning Chu, Xiao Chen, Junfeng Xiao, Jianfeng Xu

2021Materials Science in Semiconductor Processing26 citationsDOI

Topics & Concepts

Materials scienceExtrusionVibrationRake angleShear (geology)Enhanced Data Rates for GSM EvolutionComposite materialCrystalline siliconSiliconMechanism (biology)Cutting toolStructural engineeringMechanical engineeringMechanicsMetallurgyMachiningAcousticsEngineeringPhysicsTelecommunicationsPhilosophyEpistemologyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationLaser Material Processing Techniques
Numerical investigation on material removal mechanism in elliptical vibration cutting of single-crystal silicon | Litcius