Litcius/Paper detail

High strength, high toughness, low thermal conductivity, and appropriate expansion capacity of hybrid organic/inorganic nanocomposites used for thermal protection

Hai Long Liu, Bin Wei, Xin Jing Wei, Xiao Tong Yi, Si Tang, Yu Dong Huang, Jin He, Chao Wang

2021Ceramics International19 citationsDOI

Topics & Concepts

Materials scienceComposite materialThermal expansionThermal conductivityCompressive strengthScanning electron microscopeNanocompositeCompression moldingThermogravimetric analysisFlexural strengthToughnessFracture toughnessFourier transform infrared spectroscopyChemical engineeringEngineeringMoldPolymer Nanocomposites and PropertiesThermal properties of materialsAdvanced ceramic materials synthesis