Electrochemical corrosion behaviour and corrosion mechanism of Sn-9Zn-xGe solder alloys in NaCl solution
Cunji Pu, Caiju Li, Yingde Miao, Qiong Lu, Jubo Peng, Zunyan Xu, Xin Zhang, Jianhong Yi
Abstract
The electrochemical corrosion behaviour and corrosion mechanism of Sn-9Zn-xGe alloy in 3.5 wt.% NaCl solution was investigated using electrochemical techniques combined with surface characterization techniques. The results showed that the alloy corrosion was mainly affected by the rupture of passivation film and Cl - migration along grain boundaries. Trace Germanium (Ge) addition refined the microstructure and improved the corrosion potential of the alloy. Solder alloys containing 0.6 wt.% Ge formed a uniform and dense passivation film on the corrosion surfaces , which reduced the corrosion rate and increased the corrosion resistance .
Topics & Concepts
CorrosionPassivationMaterials scienceMetallurgyAlloyElectrochemistryMicrostructureGrain boundaryIntergranular corrosionElectrodeComposite materialChemistryLayer (electronics)Physical chemistryElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisAluminum Alloy Microstructure Properties