Improvement of heat aging resistance and tensile strength of SAC305/Cu solder joints by multi-element microalloying
Jikang Yan, Biao Wang, Jianhua Zhao, Lingyan Zhao, Runjie Guo, Jianhua Sheng
Topics & Concepts
Materials scienceSolderingUltimate tensile strengthMetallurgyHeat resistanceComposite materialElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesMetallurgical and Alloy Processes