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Fabrication of Titanium and Copper-Coated Diamond/Copper Composites via Selective Laser Melting

Lu Zhang, Yan Li, Simeng Li, Ping Gong, Qiaoyu Chen, Haoze Geng, Minxi Sun, Qinglei Sun, Liang Hao

2022Micromachines22 citationsDOIOpen Access PDF

Abstract

The poor wettability and weak interfacial bonding of diamond/copper composites are due to the incompatibility between diamond and copper which are inorganic nonmetallic and metallic material, respectively, which limit their further application in next-generation heat management materials. Coating copper and titanium on the diamond particle surface could effectively modify and improve the wettability of the diamond/copper interface via electroless plating and evaporation methods, respectively. Here, these dense and complex composites were successfully three-dimensionally printed via selective laser melting. A high thermal conductivity (TC, 336 W/mK) was produced by 3D printing 1 vol.% copper-coated diamond/copper mixed powders at an energy density of 300 J/mm3 (laser power = 180 W and scanning rate = 200 mm/s). 1 and 3 vol.% copper-coated diamond/copper composites had lower coefficients of thermal expansions and higher TCs. They also had stronger bending strengths than the corresponding titanium-coated diamond/copper composites. The interface between copper matrix and diamond reinforcement was well bonded, and there was no cracking in the 1 vol.% copper-coated diamond/copper composite sample. The optimization of the printing parameters and strategy herein is beneficial to develop new approaches for the further construction of a wider range of micro-sized diamond particles reinforced metal matrix composites.

Topics & Concepts

CopperMaterials scienceDiamondComposite materialWettingTitaniumComposite numberThermal conductivityMetallurgyAdditive Manufacturing and 3D Printing TechnologiesAdditive Manufacturing Materials and ProcessesDiamond and Carbon-based Materials Research
Fabrication of Titanium and Copper-Coated Diamond/Copper Composites via Selective Laser Melting | Litcius