Scalable perovskite coating <i>via</i> anti-solvent-free Lewis acid–base adduct engineering for efficient perovskite solar modules
Do Kyung Lee, Kwang‐Soo Lim, Jin‐Wook Lee, Nam‐Gyu Park
Abstract
High-quality large-area perovskite films are realized by an anti-solvent-free adduct approach using 1,3-dimethyl-3,4,5,6-tetrahydro-2(1<italic>H</italic>)-pyrimidinone (DMPU) as a Lewis base additive.
Topics & Concepts
AdductPerovskite (structure)Lewis acids and basesBase (topology)SolventChemistryCoatingMaterials scienceScalabilityOrganic chemistryComputer scienceCatalysisMathematicsOperating systemMathematical analysisPerovskite Materials and ApplicationsConducting polymers and applicationsPolyoxometalates: Synthesis and Applications