Trace bis-(3-sulfopropyl)-disulfide enhanced electrodeposited copper foils
Lingling Liu, Yeqiang Bu, Yue Sun, Jianfeng Pan, Jiabin Liu, Jien Ma, Lin Qiu, Youtong Fang
Topics & Concepts
CopperMaterials scienceElectrochemistryScanning electron microscopeUltimate tensile strengthFOIL methodSurface roughnessSurface finishAdsorptionMetallurgyCopper platingComposite materialChemical engineeringElectrodeElectroplatingChemistryLayer (electronics)Organic chemistryPhysical chemistryEngineeringElectrodeposition and Electroless CoatingsNanomaterials and Printing TechnologiesElectronic Packaging and Soldering Technologies