Atomistic mechanisms of SiC electrochemical mechanical polishing in aqueous H2O2: A ReaxFF molecular dynamics study
Rui Zhu, Tianyu Zhang, Qingyu Yao, Yang Peng, Feng Cheng, Zirui Wang, Yongguang Wang, Xiaolong Lu, C.M. Wang, Yongwu Zhao
Topics & Concepts
ReaxFFMaterials scienceMolecular dynamicsAqueous solutionElectrochemistryPolishingChemical-mechanical planarizationNanotechnologyChemical physicsComposite materialPhysical chemistryComputational chemistryInteratomic potentialElectrodeChemistryPhysicsAdvanced Surface Polishing TechniquesAdvanced ceramic materials synthesisSemiconductor materials and devices