Litcius/Paper detail

Thermoelectric cooler with embedded teardrop-shaped milli-channel heat sink for electronics cooling

Xiangjun Liu, Feng Zheng, Qiang Fu, Guanyao Song, Yucheng Xiong

2024Applied Thermal Engineering32 citationsDOI

Topics & Concepts

Heat sinkThermoelectric coolingElectronicsThermoelectric effectMaterials scienceEngineering physicsElectronics coolingSink (geography)Mechanical engineeringChannel (broadcasting)Electrical engineeringEngineeringOptoelectronicsPhysicsThermodynamicsGeographyCartographyAdvanced Thermoelectric Materials and DevicesHeat Transfer and OptimizationThermal properties of materials