Investigation on liquid-cooled heat sink integrating topology optimization and microchannel design for high heat flux chip cooling
Ningbo Wang, Bo Tian, Yanhua Guo, Junshan Li, Shuangquan Shao
Topics & Concepts
Topology optimizationMicrochannelHeat sinkPressure dropHeat fluxTopology (electrical circuits)Mechanical engineeringMaterials scienceChipJunction temperatureEngineeringThermalThermal resistanceComputer coolingMechanicsElectronic engineeringElectronics coolingComputer scienceHydraulic diameterPower (physics)Cooling capacityHeat Transfer and OptimizationTopology Optimization in EngineeringBuilding Energy and Comfort Optimization