Reliability evaluation of ultra thin 3D-IC package under the coupling load effects of the manufacturing process and temperature cycling test
Chang‐Chun Lee, Yu-Min Lin, Hou‐Chun Liu, Ji-Yuan Syu, Yuan‐Cheng Huang, Tao‐Chih Chang
Topics & Concepts
Temperature cyclingMaterials scienceSolderingInterconnectionCreepFlip chipReliability (semiconductor)Residual stressCoupling (piping)Stress (linguistics)Composite materialThree-dimensional integrated circuitChip-scale packageIntegrated circuitThermalOptoelectronicsComputer scienceLayer (electronics)PhilosophyMeteorologyPhysicsWaferQuantum mechanicsComputer networkLinguisticsAdhesivePower (physics)Electronic Packaging and Soldering Technologies3D IC and TSV technologiesIntegrated Circuits and Semiconductor Failure Analysis