Effects of minor alloying with Ge and In on the interfacial microstructure between Zn–Sn solder alloy and Cu substrate
Yuhang Wei, Yingxia Liu, Xiuchen Zhao, Chengwen Tan, Ya‐ru Dong, Ji Zhang
Topics & Concepts
IntermetallicMaterials scienceSubstrate (aquarium)DiffusionPhase (matter)AlloyLayer (electronics)MicrostructureActivation energyMetallurgySolderingPrecipitationAnalytical Chemistry (journal)CrystallographyChemistryThermodynamicsComposite materialPhysical chemistryGeologyOceanographyMeteorologyChromatographyPhysicsOrganic chemistryElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesIntermetallics and Advanced Alloy Properties