Modeling and experimental investigation of monocrystalline silicon wafer cut by diamond wire saw
Yan Wang, Shengju Huang, Zhaofeng Qian, Jinhuan Su, Lin Du
Topics & Concepts
Monocrystalline siliconWaferMaterials scienceSiliconDiamondWafer backgrindingSemiconductor device fabricationMechanical engineeringOptoelectronicsWafer dicingComposite materialEngineeringAdvanced Surface Polishing TechniquesTunneling and Rock MechanicsAdvanced machining processes and optimization