Thermal reliability of Cu sintering joints for high-temperature die attach
Junhyuk Son, Dong-Yurl Yu, Yun-Chan Kim, Shin‐Il Kim, Dongjin Byun, Junghwan Bang
Topics & Concepts
Kirkendall effectMaterials scienceThermal shockIntermetallicSinteringCopperShear strength (soil)MetallurgyOxideThermal expansionComposite materialDie (integrated circuit)Direct shear testThermal diffusivityShear (geology)AlloyNanotechnologyPhysicsSoil waterEnvironmental scienceSoil scienceQuantum mechanicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability