Analysis of nano grinding removal mechanism of 3C-SiC material under the coupling action of double abrasive grains
Xiuting Zhao, Ziyue Wang, Tonglin Zhao, Ping Yang, Chong Yue
Topics & Concepts
AbrasiveMaterials sciencePolishingGrindingCoupling (piping)Composite materialNanometreNano-MetallurgyAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationDiamond and Carbon-based Materials Research