Influence of Indium addition on microstructural and mechanical behavior of Sn solder alloys: Experiments and first principles calculations
Amey Luktuke, Arun Sundar S. Singaravelu, Arun Mannodi‐Kanakkithodi, Nikhilesh Chawla
Topics & Concepts
Materials scienceMicrostructureSolderingIntermetallicNanoindentationScanning electron microscopeIndiumElectron backscatter diffractionGrain sizeMetallurgyComposite materialAlloyElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesAluminum Alloy Microstructure Properties