Characterization and Selection of Tailorable Heat Triggered Epoxy Shape Memory Polymers for Epoxy Debondable Adhesives
Asif Istiak, Hak Gu Lee, Hui Yun Hwang
Abstract
Abstract The increasing concern for environmental and economic sustainability has resulted in a growing interest in recycling the hybrid structures used in modern industries. To address the challenge of easy separation without damaging the substrates, a debondable‐adhesive incorporating shape memory polymer (SMP) filler is proposed. This study synthesizes seven types of epoxy SMPs at different stoichiometric ratios of the same chemicals. The thermomechanical, mechanical, and recovery characteristics of the SMPs are evaluated, and the most suitable candidate for debondable‐adhesive application is selected based on the selection criteria of SMP for embedding in the debondable adhesive. The results of this study offer valuable insights into the potential SMPs which can be incorporated in debondable adhesives used in modern industries.