Preparation of a low dielectric POSS/epoxy hybrid polymer without sacrificing the mechanical performance
Pengbo Zhang, Kangle Xue, Hailong Liu, Zidie Song, Xiaoxue Sun, Tongjie Yao, Li Liu
Abstract
Epoxy resins are the most widely used adhesives. Nevertheless, the high dielectric constant ( D k ) and dielectric loss ( D f ) drastically limit their application in fifth-generation (5G) technologies.
Topics & Concepts
EpoxyChemistryDielectricAdhesivePolymerDielectric lossComposite materialPolymer chemistryLimit (mathematics)OptoelectronicsOrganic chemistryMaterials scienceMathematical analysisPhysicsLayer (electronics)MathematicsSynthesis and properties of polymersSilicone and Siloxane ChemistryDielectric materials and actuators