Rapid heating induced ultrahigh stability of nanograined copper
Xiuyan Li, Xin Zhou, K. Lu
Abstract
(melting point), even higher than the recrystallization temperature of deformed coarse-grained Cu. The thermally induced grain boundary relaxation originating from the generation of high-density nanotwins offers an alternative approach to stabilizing nanostructured materials.
Topics & Concepts
Materials scienceGrain boundaryRecrystallization (geology)Grain sizeCopperRelaxation (psychology)NanometreMelting pointInstabilityNanoscopic scaleNanotechnologyMetallurgyChemical physicsMicrostructureComposite materialMechanicsChemistryBiologyPsychologyPhysicsSocial psychologyPaleontologyMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesMetal and Thin Film Mechanics