Recent Progress in Metallurgical Bonding Mechanisms at the Liquid/Solid Interface of Dissimilar Metals Investigated via in situ X-ray Imaging Technologies
Zongye Ding, Naifang Zhang, Yu Liao, Wenquan Lu, Jianguo Li, Qiaodan Hu
Topics & Concepts
Materials scienceMicroelectronicsMicrostructureIntermetallicSolderingInterface (matter)Synchrotron radiationSynchrotronInterconnectionMechanical engineeringEngineering physicsMetallurgyNanotechnologyComposite materialComputer scienceOpticsAlloyEngineeringCapillary actionCapillary numberPhysicsComputer networkElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability