Effects of size and cooling rate on solidification behavior of freestanding Sn-3.0Ag-0.5Cu solder balls
Xiaolei Ren, Yunpeng Wang, Longjiang Zou, Xiaoying Liu, Ning Zhao
Topics & Concepts
MicrostructureMaterials scienceSolderingGrain sizeNucleationMetallurgySupercoolingBall (mathematics)Composite materialThermodynamicsPhysicsMathematicsMathematical analysisElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure Properties3D IC and TSV technologies