Environment-friendly chemical mechanical polishing for copper with atomic surface confirmed by transmission electron microscopy
Dongdong Liu, Zhenyu Zhang, Jiajian Feng, Zhibin Yu, Fanning Meng, Chunjing Shi, Guanghong Xu, Shuyan Shi, Wei Liu
Topics & Concepts
PolishingCopperChemical-mechanical planarizationMaterials scienceSlurrySurface roughnessTransmission electron microscopyScanning electron microscopeHigh-resolution transmission electron microscopySurface finishAtomic numberComposite materialAnalytical Chemistry (journal)Chemical engineeringMetallurgyNanotechnologyChemistryAtomic physicsEngineeringChromatographyPhysicsElectronic and Structural Properties of OxidesZnO doping and propertiesAdvanced Surface Polishing Techniques