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Study of the humidity-controlled CeO2 fixed-abrasive chemical mechanical polishing of a single crystal silicon wafer

Gengzhuo Li, Chen Xiao, Shibo Zhang, Shengquan Luo, Yuhan Chen, Yongbo Wu

2022Tribology International45 citationsDOI

Topics & Concepts

PolishingAbrasiveMaterials scienceWaferChemical-mechanical planarizationHumidityGrindingSurface roughnessComposite materialSurface finishSiliconRelative humidityMetallurgyOptoelectronicsThermodynamicsPhysicsAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchAdvanced machining processes and optimization
Study of the humidity-controlled CeO2 fixed-abrasive chemical mechanical polishing of a single crystal silicon wafer | Litcius