A novel UV-curable epoxy resin modified with cholic acid for high-frequency dielectric packaging
Wanjing Liu, Pan Tian, Yisen Huang, Junhua Zhang
Topics & Concepts
Materials scienceEpoxyDielectricCuring (chemistry)MethacrylateDouble bondGlass transitionGlycidyl methacrylateMethacrylic acidComposite materialSolderingPolymer chemistryCopolymerPolymerOptoelectronicsSynthesis and properties of polymersSilicone and Siloxane ChemistryPhotopolymerization techniques and applications