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Ni and Ni–P substrates inhibit Bi phase segregation and IMC overgrowth during the soldering process of Sn–Bi solder

Min Shang, Jinye Yao, Jing Xing, Xiangqing Liu, Yunpeng Wang, Haoran Ma, Haitao Ma, Haitao Ma, Haitao Ma

2024Materials Chemistry and Physics12 citationsDOI

Topics & Concepts

SolderingMetallurgyPhase (matter)Materials scienceProcess (computing)ChemistryComputer scienceOperating systemOrganic chemistryElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis
Ni and Ni–P substrates inhibit Bi phase segregation and IMC overgrowth during the soldering process of Sn–Bi solder | Litcius