Interfacial bonding mechanisms of sintered Cu nanoparticles on different metallization surfaces
Yongchao Wu, Guisheng Zou, Shuaiqi Wang, Wei Guo, Hongqiang Zhang, Lei Liu
Topics & Concepts
Materials scienceSinteringNanoparticleShear strength (soil)Composite materialCopperSubstrate (aquarium)DiffusionSurface diffusionDiffusion barrierMonolayerMetallurgyLayer (electronics)NanotechnologyAdsorptionGeologyPhysicsEnvironmental scienceOrganic chemistryChemistryThermodynamicsSoil scienceSoil waterOceanographyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloys Composites Properties