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Location-dependent microstructure analysis and mechanical behavior of inconel 625 using Cold Metal Transfer(CMT) based wire and arc additive manufacturing

M. Karmuhilan, S. Kumanan

2022Vacuum35 citationsDOI

Topics & Concepts

Electron backscatter diffractionMaterials scienceInconel 625MicrostructureIndentation hardnessInconelMetallurgyAlloyUltimate tensile strengthDiffractionTexture (cosmology)Grain boundaryNickelGrain sizeOpticsImage (mathematics)PhysicsArtificial intelligenceComputer scienceAdditive Manufacturing Materials and ProcessesHigh Entropy Alloys StudiesAdditive Manufacturing and 3D Printing Technologies
Location-dependent microstructure analysis and mechanical behavior of inconel 625 using Cold Metal Transfer(CMT) based wire and arc additive manufacturing | Litcius