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Enhancing mechanism of interfacial metal element on the thermal transport across Cu-graphene interfaces revealed by molecular dynamics simulations

Xin Wang, Xueliang Wang, Zhe Wang, Yongli Guo, Yaping Wang

2020Materials Today Communications30 citationsDOI

Topics & Concepts

Materials scienceGrapheneMolecular dynamicsCopperMetalThermal conductivityComposite numberComposite materialMatrix (chemical analysis)Chemical physicsMetal matrix compositeNanotechnologyMetallurgyComputational chemistryPhysicsChemistryThermal properties of materialsGraphene research and applicationsAluminum Alloys Composites Properties
Enhancing mechanism of interfacial metal element on the thermal transport across Cu-graphene interfaces revealed by molecular dynamics simulations | Litcius