Effect of novel non-inhibitor slurry on chemical mechanical polishing properties of copper interconnect copper film based on experiments and theoretical calculations
Chao He, Xinhuan Niu, Jianghao Liu, Ni Zhan, Yida Zou, Changxin Dong, Xinjie Li, Jiabao Cheng, Yunhui Shi, Xiaodong Luan
Topics & Concepts
CopperChemical-mechanical planarizationSlurryInterconnectionPolishingMaterials scienceChemical engineeringComposite materialMetallurgyComputer scienceEngineeringComputer networkAdvanced Surface Polishing TechniquesCopper Interconnects and ReliabilityAnodic Oxide Films and Nanostructures